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CATEGORY

Electronics

OLED Auto Panel Market Share Set to Hit 10% by 2026

The latest “Automotive Display Market Analysis” from TrendForce indicates that the overall demand for automotive display panels (automotive panels) is gradually stabilizing and shows an upward...

Self-Driving SoCs Are Becoming A Critical Gateway for IC Design Firms

In the era of increasing electric vehicle penetration and automotive electrification, the future of cars resembles smartphones on wheels, demanding substantial computing power for...

GaN in Automotive Applications and Who’s Leading?

The competitive advantage of automotive GaN components is becoming increasingly prominent. Leveraging their exceptional material characteristics, SiC components are rapidly making inroads into sectors such...

Nio unveils 1st in-house developed chip, mass production to begin in Oct

The Yangjian chip will allow Nio to save about $100 per vehicle and recover its development costs in about a year, William Li said. The...

Sony to Release CMOS Image Sensor for Automotive Cameras with 17.42-Effective Megapixels

Sony Semiconductor Solutions Corporation announced the upcoming release of the IMX735, a new CMOS image sensor for automotive cameras with the industry's highest*1 pixel...

Are OLEDs and MicroLEDs set to Disrupt the Current TFT-LCD Dominance in the Automotive Display Sector?

The current automotive display market is dominated by the TFT-LCD technology, and despite the rise of OLEDs in this sector, it is expected this...

Rumors of Apple Car Possibly Using Micro LED, Could Spark an Automotive Revolution if True

According to a report by TechNews, it’s widely known that Apple has been quietly working on a not-so-secretive project known as “Project Titan,” which...

Impending Clash in the Global SiC Production Race

Last week, major power semiconductor manufacturer Infineon announced plans to invest up to 5 billion euros over the next five years to construct the...

A novel laser slicing technique for diamond semiconductors

The new technique uses laser pulses to slice diamond into thin wafers, paving the way for its adoption as a next-generation semiconductor material Chiba University Silicon-based...

Leapmotor integrates Four domains into one electrical architecture

Leapmotor unveiled its latest innovative achievement – ‘Four-Leaf Clover’ Central Integrated Electronic and Electrical Architecture (hereinafter referred to as ‘Four-Leaf Clover’ architecture). The ‘Four-Leaf...

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