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Semiconductors

Automotive RISC-V Chip Industry Review 2024

Automotive RISC-V Research: Customized chips may become the future trend, and RISC-V will challenge ARM What is RISC-V?Reduced Instruction Set Computing - Five (RISC-V) is...

Toyota and Other Automakers Reportedly Join Forces for the Development of Advanced Automotive Chips

In a bid to compete with rivals like Tesla, who conduct in-house research and development of advanced chips for automotive applications, Japanese automakers have reportedly...

High Performance Computing for Automotive

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller,...

6G: technological advancement trajectories and global roadmap

Every decade, a new telecom generation emerges, with 5G currently being commercialized, offering faster data rates, low latency, and enhanced reliability. 6G is characterized...

Infinite Opportunities in Automotive Sector as IC Design Companies Compete for Self-Driving SoC

In TrendForce’s report on the self-driving System-on-Chip (SoC) market, it has witnessed rapid growth, which is anticipated to soar to $28 billion by 2026, boasting...

Major Acquisition in SiC/GaN Semiconductor Industry Concludes as Infineon Completes GaN Systems Purchase

What started as a groundbreaking acquisition in the SiC/GaN third-generation semiconductor and power semiconductor sector came to a satisfying conclusion on October 24th. In March...

Self-Driving SoCs Are Becoming A Critical Gateway for IC Design Firms

In the era of increasing electric vehicle penetration and automotive electrification, the future of cars resembles smartphones on wheels, demanding substantial computing power for...

GaN in Automotive Applications and Who’s Leading?

The competitive advantage of automotive GaN components is becoming increasingly prominent. Leveraging their exceptional material characteristics, SiC components are rapidly making inroads into sectors such...

Impending Clash in the Global SiC Production Race

Last week, major power semiconductor manufacturer Infineon announced plans to invest up to 5 billion euros over the next five years to construct the...

A novel laser slicing technique for diamond semiconductors

The new technique uses laser pulses to slice diamond into thin wafers, paving the way for its adoption as a next-generation semiconductor material Chiba University Silicon-based...

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