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Electronics

Hesai Releases Ultra-Thin Behind-the-Windshield ADAS Lidar Solution

Hesai Technology officially releases the latest automotive-grade, ultra-thin long-range lidar ET25. ET stands for "Extremely Thin". Named after its height, ET25 is only 25...

Rise of High-Performance TIMs in ADAS and Data Centers

Thermal Interface Materials (TIMs) come in different forms and thermal conductivities. Typical TIM forms include gap pads, thermal greases, thermally conductive adhesives (TCA), and phase...

BYD flexes innovation muscle, unveils intelligent body control system

BYD officially unveiled its intelligent body control system called DiSus, a technological breakthrough that follows its DM Super Hybrid technology, e-Platform 3.0, Blade Battery...

Carmakers are mistaken if they think chip shortages are over – they need to reinvent themselves while there’s time

Howard Yu, International Institute for Management Development (IMD) Finally, carmakers got a break. Those in the UK boosted their output by over 13% in February...

LG Innotek targets autonomous driving market with 2nd generation ‘5G-V2X Cellular Module’

LG Innotek announced on the 6th on succeeding the development of '5G-V2X Cellular Module' that is significantly improved with the long-distance data transmission based...

GaN Semiconductor Devices Market To Reach USD 4490.5 Million By 2029, CAGR of 23.3%

The global GaN Semiconductor Devices market was valued at USD 1011.1 million in 2022 and is anticipated to reach USD 4490.5 million by 2029,...

Toyoda Gosei Develops Millimeter Wave Radar Compatible Emblem that Emits Light

Toyoda Gosei Co., Ltd. has developed the world’s first* automobile emblem that is both transparent to millimeter wave radar and luminescent. This product will...

The Tantalizing Potential for GaN in Electric Vehicle Power Electronics

As electric vehicle (EV) power electronics undergoes a paradigm shift towards wide bandgap (WBG) semiconductors, it is clear that silicon carbide (SiC) is becoming...

Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown

Global fab equipment spending for front-end facilities is expected to decrease 22% year-over-year (YoY) to US$76 billion in 2023 from a record high of US$98...

Mitsubishi Builds New Wafer Plant to Boost SiC Power Semiconductor Business

Mitsubishi Electric Corporation announced it will double a previously announced its investment plan to approximately 260 billion yen in the five-year period to March...

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