Honda Motor Co., Ltd. (Honda) and IBM have signed a Memorandum of Understanding (MOU) to embark on the long-term joint research and development of next-generation semiconductor and software technologies essential for the future of software-defined vehicles (SDVs). This partnership aims to tackle significant challenges associated with processing capability, power consumption, and design complexity, which are crucial for the realization of advanced SDVs.
As the automotive industry progresses towards 2030 and beyond, the integration of intelligence and AI technologies is expected to surge, paving the way for the development of SDVs. Honda and IBM foresee that these vehicles will require semiconductors with significantly higher processing performance and lower power consumption than those in conventional mobility products. The collaboration seeks to develop specialized semiconductor technologies, including brain-inspired computing and chiplet technologies, to meet these demands.
Innovative Research Focus
The MOU outlines key areas for potential joint research:
- Brain-Inspired Computing: Developing computer architecture and algorithms that mimic the brain’s structure and function, optimized for silicon, to enhance processing performance while reducing power consumption.
- Chiplet Technologies: Exploring modular semiconductor components that can be combined to improve performance and efficiency.
Additionally, the partnership emphasizes the importance of hardware and software co-optimization. This approach ensures high performance and faster market readiness by managing the increased design complexity of future SDVs. The companies plan to explore open and flexible software solutions as part of this effort.
Strategic Implications
This collaboration marks the first large-scale partnership between Honda and IBM, as confirmed by a Honda source to Nikkei Asia. While specific details regarding the schedule and roles of each company are yet to be finalized, the MOU sets the stage for significant advancements in automotive technology.
Honda’s commitment to this joint venture comes amid a challenging market environment, particularly in China. The company faces stiff competition from lower-priced Chinese-made vehicles and has adjusted its sales forecast for FY24, projecting a 13% decrease to 1.06 million cars compared to the previous year. This is also a 40% decline from the record high in 2020. In response, Honda’s joint venture with Guangzhou Automotive Group has implemented voluntary layoffs for 1,700 employees to streamline operations.
Future Prospects
Through this collaboration, Honda and IBM aim to develop SDVs that feature top-tier computing capabilities and power efficiency. This initiative not only highlights the companies’ commitment to innovation but also underscores their strategic move to address the evolving demands of the automotive industry.
As the world moves closer to a future dominated by smart and sustainable transportation, the Honda-IBM partnership represents a significant step towards realizing highly competitive, energy-efficient SDVs. The success of this venture could set a new benchmark for the automotive and technology sectors, driving forward the next wave of mobility solutions.
